BSI BS EN 60749-37:2008

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Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer

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Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer


SDO	BSI: British Standards Institution
Document Number	BS EN 60749-37
Publication Date	May 30, 2008
Language	en - English
Page Count	22
Revision Level
Supercedes
Committee

Publish Date	Document Id	Type	View
May 30, 2008	BS EN 60749-37:2008	Revision

SDO	Document	Title
BSI	BS EN 60749-37	Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer
BSI	BS EN IEC 60749-37	Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer.
IEC	IEC 60749-37	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
BSI	BS EN 60749-40	Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
IEC	IEC 60749-40	Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
BSI	BS EN 60749	Semiconductor devices. Mechanical and climatic test methods
BSI	BS EN 60749-8	Semiconductor devices. Mechanical and climatic test methods. Sealing
BSI	BS EN 60749-29	Semiconductor devices. Mechanical and climatic test methods. Latch-up test
BSI	BS EN 60749-34	Semiconductor devices. Mechanical and climatic test methods. Power cycling
BSI	BS EN 60749-36	Semiconductor devices. Mechanical and climatic test methods. Acceleration, steady state
BSI	BS EN 60749-10	Semiconductor devices. Mechanical and climatic test methods. Mechanical shock
BSI	BS EN 60749-22	Semiconductor devices. Mechanical and climatic test methods. Bond strength
BSI	BS EN 60749-1	Semiconductor devices. Mechanical and climatic test methods. General
IEC	IEC 60749-8	Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
BSI	BS EN 60749-25	Semiconductor devices. Mechanical and climatic test methods. Temperature cycling
IEC	IEC 60749-34	Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC	IEC 60749-29	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC	IEC 60749-36	Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
BSI	BS EN 60749-21	Semiconductor devices. Mechanical and climatic test methods. Solderability
BSI	BS EN 60749-2	Semiconductor devices. Mechanical and climatic test methods. Low air pressure
IEC	IEC 60749-22	Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC	IEC 60749-1	Semiconductor devices - Mechanical and climatic test methods - Part 1: General
BSI	BS EN 60749-13	Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
BSI	BS EN IEC 60749-13	Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
BSI	BS EN 60749-9	Semiconductor devices. Mechanical and climatic test methods. Permanence of marking
BSI	BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods. Mechanical shock. device and subassembly.
BSI	BS EN IEC 60749-17	Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation.
BSI	BS EN 60749-17	Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation
IEC	IEC 60749-25	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC	IEC 60749-2	Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
BSI	BS EN IEC 60749-18	Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose).
BSI	BS EN 60749-18	Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose)
BSI	BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods. Soft error test method for semiconductor devices with memory
BSI	BS EN 60749-3	Semiconductor devices. Mechanical and climatic test methods. External visual examination
BSI	BS EN 60749-24	Semiconductor devices. Mechanical and climatic test methods. Accelerated moisture resistance. Unbiased HAST

BSI BS EN 60749-37:2008

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer

Document Information

Overview

Revision Details

Document History

BSI BS EN 60749-37:2008

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer

Document Information

Overview

Revision Details

Document History

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