| BSI |
BS EN 60749-21 |
Semiconductor devices. Mechanical and climatic test methods. Solderability |
|
| IEC |
IEC 60749-21 |
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
|
| BSI |
BS EN 60749 |
Semiconductor devices. Mechanical and climatic test methods |
|
| BSI |
BS EN 60749-1 |
Semiconductor devices. Mechanical and climatic test methods. General |
|
| BSI |
BS EN 60749-10 |
Semiconductor devices. Mechanical and climatic test methods. Mechanical shock |
|
| BSI |
BS EN 60749-8 |
Semiconductor devices. Mechanical and climatic test methods. Sealing |
|
| BSI |
BS EN 60749-29 |
Semiconductor devices. Mechanical and climatic test methods. Latch-up test |
|
| BSI |
BS EN 60749-22 |
Semiconductor devices. Mechanical and climatic test methods. Bond strength |
|
| IEC |
IEC 60749-1 |
Semiconductor devices - Mechanical and climatic test methods - Part 1: General |
|
| BSI |
BS EN 60749-34 |
Semiconductor devices. Mechanical and climatic test methods. Power cycling |
|
| IEC |
IEC 60749-8 |
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
|
| BSI |
BS EN 60749-25 |
Semiconductor devices. Mechanical and climatic test methods. Temperature cycling |
|
| BSI |
BS EN IEC 60749-13 |
Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere |
|
| BSI |
BS EN 60749-13 |
Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere |
|
| BSI |
BS EN IEC 60749-10 |
Semiconductor devices. Mechanical and climatic test methods. Mechanical shock. device and subassembly. |
|
| BSI |
BS EN 60749-2 |
Semiconductor devices. Mechanical and climatic test methods. Low air pressure |
|
| IEC |
IEC 60749-29 |
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
|
| BSI |
BS EN 60749-42 |
Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage |
|
| BSI |
BS EN IEC 60749-17 |
Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation. |
|
| BSI |
BS EN 60749-17 |
Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation |
|
| BSI |
BS EN 60749-36 |
Semiconductor devices. Mechanical and climatic test methods. Acceleration, steady state |
|
| IEC |
IEC 60749-22 |
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
|
| IEC |
IEC 60749-34 |
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
|
| BSI |
BS EN 60749-38 |
Semiconductor devices. Mechanical and climatic test methods. Soft error test method for semiconductor devices with memory |
|
| BSI |
BS EN 60749-6 |
Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature |
|
| BSI |
BS EN 60749-9 |
Semiconductor devices. Mechanical and climatic test methods. Permanence of marking |
|
| IEC |
IEC 60749-25 |
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
|
| IEC |
IEC 60749-2 |
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure |
|
| IEC |
IEC 60749-13 |
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
|
| BSI |
BS EN 60749-3 |
Semiconductor devices. Mechanical and climatic test methods. External visual examination |
|
| IEC |
IEC 60749-19 |
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
|
| IEC |
IEC 60749-10 |
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly |
|
| BSI |
BS EN 60749-18 |
Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose) |
|
| BSI |
BS EN IEC 60749-18 |
Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose). |
|
| IEC |
IEC 60749-42 |
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
|
| IEC |
IEC 60749-17 |
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation |
|
| IEC |
IEC 60749-36 |
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
|
| BSI |
BS EN IEC 60749-41 |
Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices. |
|
| BSI |
BS EN 60749-12 |
Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency |
|
| BSI |
BS EN IEC 60749-12 |
Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency |
|
| IEC |
IEC 60749-9 |
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
|
| IEC |
IEC 60749-6 |
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
|
| BSI |
BS EN 60749-43 |
Semiconductor devices - Mechanical and climatic test methods. Guidelines for IC reliability qualification plans |
|
| IEC |
IEC 60749-38 |
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory |
|
| IEC |
IEC 60749-3 |
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
|
| BSI |
BS EN IEC 60749-5 |
Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test |
|
| BSI |
BS EN 60749-5 |
Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test |
|
| IEC |
IEC 60749-23 |
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
|
| BSI |
BS EN 60749-16 |
Semiconductor devices. Mechanical and climatic test methods. Particle impact noise detection (PIND) |
|
| BSI |
BS EN 60749-31 |
Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (internally induced) |
|
| IEC |
IEC 60749-18 |
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) |
|
| BSI |
BS EN 60749-14 |
Semiconductor devices. Mechanical and climatic test methods. Robustness of terminations (lead integrity) |
|
| IEC |
IEC 60749-41 |
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices |
|
| BSI |
BS EN 60749-11 |
Semiconductor devices. Mechanical and climatic test methods. Rapid change of temperature. Two-fluid-bath method |
|
| IEC |
IEC 60749-12 |
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
|
| IEC |
IEC 60749-16 |
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) |
|
| BSI |
BS EN 60749-37 |
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer |
|
| BSI |
BS EN IEC 60749-37 |
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer. |
|
| BSI |
BS EN 60749-40 |
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge |
|
| BSI |
BS EN 60749-15 |
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices |
|
| BSI |
BS EN IEC 60749-15 |
Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices. |
|
| IEC |
IEC 60749-5 |
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
|
| BSI |
BS EN 60749-24 |
Semiconductor devices. Mechanical and climatic test methods. Accelerated moisture resistance. Unbiased HAST |
|
| IEC |
IEC 60749-31 |
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) |
|
| IEC |
IEC 60749-32 |
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
|
| BSI |
BS EN 60749-4 |
Semiconductor devices. Mechanical and climatic test methods. Damp heat, steady state, highly accelerated stress test (HAST) |
|
| BSI |
BS EN 60749-30 |
Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing |
|
| BSI |
BS EN IEC 60749-30 |
Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing. |
|
| IEC |
IEC 60749-14 |
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
|
| IEC |
IEC 60749-11 |
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
|
| BSI |
BS EN 60749-33 |
Semiconductor devices. Mechanical and climatic test methods. Accelerated moisture resistance. Unbiased autoclave |
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