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BSI BS EN 60191-6-4:2003

Current Revision

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA)

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OUTLINE DRAWINGS OF SURFACE MO

SDO BSI: British Standards Institution
Document Number BS EN 60191
Publication Date Aug. 4, 2003
Language en - English
Page Count 20
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Aug. 4, 2003 BS EN 60191-6-4:2003 Revision