BSI |
BS CECC 23800-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections |
|
BSI |
BS EN 123500-800 |
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
|
BSI |
BS CECC 123500-003 |
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
|
BSI |
BS CECC 23600-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections |
|
BSI |
BS EN 123400-800 |
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
|
BSI |
BS CECC 123400-003 |
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
|
BSI |
BS EN 123800 |
Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
|
BSI |
BS CECC 23700-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections |
|
BSI |
BS CECC 23300-003 |
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
|
BSI |
BS EN 123600 |
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections |
|
BSI |
BS EN 123500 |
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections |
|
BSI |
BS 123800-003 |
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
|
BSI |
BS CECC 23300-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards |
|
BSI |
BS EN 123400 |
Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
|
BSI |
BS 123600-003 |
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
|
BSI |
BS CECC 23200-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes |
|
BSI |
BS CECC 23200-003 |
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes |
|
BSI |
BS EN 123700 |
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections |
|
BSI |
BS EN 123300 |
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards |
|
BSI |
BS 123800 |
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
|
BSI |
BS CECC 23100-003 |
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
|
BSI |
BS CECC 23100-801 |
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes |
|
BSI |
BS 123500-003 |
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
|
BSI |
BS 123700-003 |
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
|
BSI |
BS 123400-003 |
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
|
BSI |
BS EN 123200 |
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes |
|
BSI |
BS 123600 |
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
|
BSI |
BS EN 123000 |
Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
|
BSI |
BS EN 160101 |
Harmonized system of quality assessment for electronic components. Blank detail specification: printed board assembly modular electronic units of assessed quality. Capability approval |
|
BSI |
BS EN 123100 |
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes |
|
BSI |
BS EN 175101-802 |
Harmonized system of quality assessment for electronic components. Detail specification. Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows |
|
BSI |
BS EN 122003 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification for the preparation of customer detail specifications (CDS) and detail specifications for standard production items with capability approval |
|
BSI |
BS 123300-003 |
System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
|
BSI |
BS EN 114001 |
Harmonized system of quality assessment for electronic components. Blank detail specification: photomultiplier tubes |
|
BSI |
BS CECC 75101 |
Specification for harmonized system of quality assessment for electronic components. Example detail specification/blank detail specification. Two-part and edge socket connectors for printed board application |
|
BSI |
BS EN 160100 |
Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality |
|
BSI |
BS 123500 |
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections |
|
BSI |
BS EN 113001 |
Harmonized system of quality assessment for electronic components. Blank detail specification: camera tubes |
|
BSI |
BS EN 175100 |
Harmonized system of quality assessment for electronic components. Sectional specification. Two part and edge socket connectors for printed board applications |
|
BSI |
BS EN 134102 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: multi turn concentric capacitors (qualification approval) |
|
BSI |
BS EN 150011 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: case-rated thyristors |
|
BSI |
BS CECC 68101 |
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: QUARTZ CRYSTAL UNITS (CAPABILITY APPROVAL) |
|
BSI |
BS EN 168101 |
Harmonized system of quality assessment for electronic components. Blank detail specification: quartz crystal units (capability approval) |
|
BSI |
BS CECC 35001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS QC 300301 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30601 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40202 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40203 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 12001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 13001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 14001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31801 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 32201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 132401 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 123100-800 |
Harmonized System of Quality Assessment for Electronic Components. Capability Detail S |
|
BSI |
BS CECC 18001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30302 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30501 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31301 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31401 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31501 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 64101 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 64201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31701 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40101 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40102 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40103 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 40104 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 123200-800 |
Harmonized System of Quality Assessment for Electronic Components: Capability Detail S |
|
BSI |
BS CESS 23100-801 |
Harmonized System of Quality Assessment for Electronic Components, Capability Detail S |
|
BSI |
BS EN 144001 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 144002 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 144003 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 144004 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 25401 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30101 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30202 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30301 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30701 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30801 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 30901 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS CECC 31101 |
Specification for Harmonized System of Quality Assessment for Electronic Components. B |
|
BSI |
BS EN 140211 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors. Capability approval |
|
BSI |
BS EN 147101 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: relay sockets of assessed quality |
|
BSI |
BS EN 111001 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: cathode ray tubes |
|
BSI |
BS CECC 50009 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: case-rated rectifier diodes |
|
BSI |
BS EN 150009 |
Harmonized system of quality assessment for electronic components. Blank detail specification: case-rated rectifier diodes |
|
BSI |
BS QC 301201 |
Specification for Harmonized System of Quality Assessment for Electronic Components. F |
|
BSI |
BS CECC 23300-003-91 |
Specification for Harmonized System of Quality Assessment for Electronic Components. C |
|
BSI |
BS EN 123300-800 |
Specification for Harmonized System of Quality Assessment for Electronic Components. C |
|
BSI |
BS QC 300401 |
Specification for Harmonized System of Quality Assessment for Electronic Components. F |
|
BSI |
BS CECC 31601 |
Specification for Harmonized System of Quality Assessment for Electronic Components. F |
|
BSI |
BS CECC 75100 |
Harmonized system of quality assessment for electronic components. Sectional specification: two-part and edge socket connectors for printed board application |
|
BSI |
BS EN 167100 |
Harmonized System of Quality Assessment for Electronic Components. Section Specificati |
|
BSI |
BS 123700 |
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections |
|
BSI |
BS CECC 45004 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: disc seal power tubes |
|
BSI |
BS 123400 |
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections |
|
BSI |
BS EN 150006 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Variable capacitance diode(s) |
|
BSI |
BS CECC 00013 |
Harmonized System of Quality Assessment for Electronic Components: Basic Specification |
|
BSI |
BS CECC 00012 |
Harmonized System of Quality Assessment for Electronic Components: Basic Specification |
|
BSI |
BS CECC 00017 |
Harmonized System of Quality Assessment for Electronic Components. Basic Specification |
|
BSI |
BS EN 150010 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: ambient rated thyristors |
|
BSI |
BS 123200-003 |
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
|
BSI |
BS EN 175101-809 |
Harmonized system of quality assessment for electronic components. Detail specification. Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality |
|
BSI |
BS QC 301901 |
Specification for harmonized system of quality assessment for electronic components. Fixed capacitors for use in electronic equipment. Blank detail specification. Fixed multilayer ceramic chip capacitors. Assessment level E |
|
BSI |
BS EN 111101 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Display storage tubes |
|
BSI |
BS EN 150008 |
Harmonized system of quality assessment for electronic components. Blank detail specification: ambient-rated rectifier diodes |
|
BSI |
BS CECC 50008 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: ambient-rated rectifier diodes |
|
BSI |
BS EN 160201 |
Harmonized system of quality assessment for electronic components. Blank detail specification. Microwave modular electronic units of assessed quality. Capability approval |
|
BSI |
BS CECC 40301 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Fixed precision resistors |
|
BSI |
BS CECC 90114 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: programmable logic arrays (PLA) |
|
BSI |
BS CECC 63201 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: film and hybrid integrated circuits (capability approval) |
|
BSI |
BS CECC 46001 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: cold cathode indicator tubes |
|
BSI |
BS CECC 41202 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: power potentiometers (assessment level M) |
|
BSI |
BS CECC 90302 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated voltage comparators |
|
BSI |
BS CECC 22111 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: radio frequency coaxial connections, series SMA |
|
BSI |
BS CECC 30702 |
Specification for Harmonized System for Quality Assessment for Electronic Components. |
|
BSI |
BS 166101 |
Harmonized System of Quality Assessment for Electronic Components. Blank Detail Specif |
|
BSI |
BS EN 138101 |
Harmonized System of Quality Assessment for Electronic Components. Blank Detail Specif |
|
BSI |
BS EN 169201 |
Harmonized System of Quality Assessment for Electronic Components. Blank Detail Specif |
|
BSI |
BS EN 167101 |
Harmonized System of Quality Assessment for Electronic Components. Blank Detail Specif |
|
BSI |
BS EN 133221 |
Harmonized System of Quality Assessment for Electronic Components. Blank Detail Specif |
|
BSI |
BS EN 130301 |
Harmonized System of Quality Assessment for Electronic Components, Blank Detail Specif |
|
BSI |
BS CECC 90202 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated operational amplifiers |
|
BSI |
BS EN 122002 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: radio frequency coaxial connectors |
|
BSI |
BS EN 112001 |
Harmonized system of quality assessment for electronic components. Blank detail specification: image converter and image intensifier tubes |
|
BSI |
BS EN 136000 |
Harmonized system of quality assessment for electronic components: generic specification: magnetrons |
|
BSI |
BS EN 175200 |
Harmonized system of quality assessment for electronic components. Sectional specification: circular connectors |
|
BSI |
BS CECC 41201 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: power potentiometers (assessment level S) |
|
BSI |
BS CECC 41102 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: preset potentiometers (assessment level M) |
|
BSI |
BS EN 169101 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: quartz crystal controlled oscillators (capability approval) |
|
BSI |
BS 6221-9 |
Printed wiring boards. Specification for flexible multilayer boards with through connections |
|
BSI |
BS EN 196103 |
Harmonized System of Quality Assessment for Electronic Components - Blank Detail Speci |
|
BSI |
BS EN 140202 |
Harmonized system of quality assessment for electronic components. Blank detail specification: fixed power resistors (Assessment level M) |
|
BSI |
BS EN 170101 |
Harmonized system of quality assessment for electronic components. Blank detail specification. Waveguide type dielectric resonators. Capability approval |
|
BSI |
BS 9766 |
Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections. |
|
BSI |
BS CECC 41101 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: preset potentiometers (assessment level S) |
|
BSI |
BS CECC 90201 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated voltage regulators |
|
BSI |
BS EN 122001 |
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: radio frequency connectors (Type MIL-C-39012) |
|
BSI |
BS QC 301900 |
Harmonized system of quality assessment for electronic components. Fixed capacitors for use in electronic equipment. Sectional specification for fixed multilayer ceramic chip capacitors |
|
BSI |
BS EN 166101 |
Harmonized system of quality assessment for electronic components. Blank detail specification: surface acoustic wave (SAW) filters. Capability approval |
|