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ASTM F979-86(1998)e1

Current Reaffirmation

Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding

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1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package.

1.2 This test method covers a test for leaks in a package that is intended to be hermetically sealed after hybrid circuit assembly. Various types of hybrid packages may be tested by this test method. The test method is nondestructive and therefore suitable for 100% inspection.

1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety problems associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


SDO ASTM: ASTM International
Document Number F979
Publication Date May 10, 1998
Language en - English
Page Count 3
Revision Level 86(1998)e1
Supercedes
Committee F01.03
Publish Date Document Id Type View
May 10, 1998 F0979-86R03 Revision
May 10, 1998 F0979-86R98E01 Reaffirmation