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ASTM F72-24

Current Revision

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)

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1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.

Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted.

1.2 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard.

1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.


SDO ASTM: ASTM International
Document Number F72
Publication Date April 1, 2024
Language en - English
Page Count 11
Revision Level 24
Supercedes
Committee B02.05
Publish Date Document Id Type View
April 1, 2024 F0072-24 Revision
Jan. 1, 2021 F0072-21 Revision
Dec. 1, 2017 F0072-17E01 Revision
Dec. 1, 2017 F0072-17 Revision
Jan. 1, 2006 F0072-06 Revision
Jan. 1, 2001 F0072-95 Revision
Jan. 1, 2001 F0072-95R01 Reaffirmation