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ASTM F638-88(2001)

Current Revision

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

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1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.


SDO ASTM: ASTM International
Document Number F638
Publication Date Jan. 1, 2001
Language en - English
Page Count 3
Revision Level 88(2001)
Supercedes
Committee F01.07
Publish Date Document Id Type View
Jan. 1, 2001 F0638-88R01 Revision
Jan. 1, 2001 F0638-88R95E01 Reaffirmation