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ASTM F636-85(1991)

Current Revision

Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)

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SDO ASTM: ASTM International
Document Number F636
Publication Date Not Available
Language en - English
Page Count 4
Revision Level 85(1991)
Supercedes
Committee .
Publish Date Document Id Type View
Not Available F0636-85R91 Revision