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ASTM F542-98

Historical Revision

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

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1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.


SDO ASTM: ASTM International
Document Number F542
Publication Date Oct. 10, 1998
Language en - English
Page Count 3
Revision Level 98
Supercedes
Committee D09.01
Publish Date Document Id Type View
May 1, 2007 F0542-07 Revision
Sept. 10, 2002 F0542-02 Revision
Oct. 10, 1998 F0542-98 Revision