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ASTM F508-77(2002)

Current Revision

Standard Practice for Specifying Thick-Film Pastes

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1.1 This practice covers the writing of specifications for thick-film pastes for electronics.

1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.

1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.


SDO ASTM: ASTM International
Document Number F508
Publication Date Dec. 10, 2002
Language en - English
Page Count 3
Revision Level 77(2002)
Supercedes
Committee F01.03
Publish Date Document Id Type View
Dec. 10, 2002 F0508-77R02 Revision
Jan. 1, 1991 F0508-77R97E01 Revision