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ASTM F487-13(2018)

Current Revision

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)

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1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only.

1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


This specification covers aluminum-1 % silicon alloy wire for semiconductor devices lead-bonding and is limited to wire of diameter up to and including 0.0020 in. (0.051 mm). The wire surface shall be clean and free of finger oils, lubricant residues, stains, and particulate matter. The elongation and breaking load shall be tested to meet the requirements prescribed. The methods in determining the wire dimensions are presented in details. Verify that the chemical requirements are satisfied by means of spectrographic analysis.


SDO ASTM: ASTM International
Document Number F487
Publication Date March 1, 2018
Language en - English
Page Count 4
Revision Level 13(2018)
Supercedes
Committee F01.03
Publish Date Document Id Type View
March 1, 2018 F0487-13R18 Revision
Jan. 1, 2013 F0487-13 Revision
Jan. 1, 2006 F0487-88R06 Reaffirmation
Jan. 1, 2001 F0487-88R01 Reaffirmation
Jan. 1, 2001 F0487-88R95E01 Reaffirmation