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ASTM E1237-93(2009)

Historical Reaffirmation

Standard Guide for Installing Bonded Resistance Strain Gages

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1.1 This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.

1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent surface preparation, mounting procedures, and verification techniques.

SDO ASTM: ASTM International
Document Number E1237
Publication Date April 1, 2009
Language en - English
Page Count 4
Revision Level 93(2009)
Supercedes
Committee E28.01
Publish Date Document Id Type View
Aug. 15, 2020 E1237-20 Revision
April 15, 2014 E1237-93R14 Reaffirmation
April 1, 2009 E1237-93R09 Reaffirmation
April 10, 1998 E1237-93R03 Reaffirmation
April 10, 1998 E1237-93R98 Reaffirmation