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ASTM E1237-20

Current Revision

Standard Guide for Installing Bonded Resistance Strain Gages

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1.1 This guide provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This guide pertains only to adhesively bonded strain gages.

1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


4.1 Methods and procedures used in installing bonded resistance strain gages can have significant effects upon the performance of those sensors. Optimum and reproducible detection of surface deformation requires appropriate and consistent strain gage and bonding technique selection, surface preparation, procedures for gage installation and adhesive use, lead wire connection, validation of operation, and protective coating application.

SDO ASTM: ASTM International
Document Number E1237
Publication Date Aug. 15, 2020
Language en - English
Page Count 5
Revision Level 20
Supercedes
Committee E28.01
Publish Date Document Id Type View
Aug. 15, 2020 E1237-20 Revision
April 15, 2014 E1237-93R14 Reaffirmation
April 1, 2009 E1237-93R09 Reaffirmation
April 10, 1998 E1237-93R03 Reaffirmation
April 10, 1998 E1237-93R98 Reaffirmation