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ASTM D1867-13

Current Revision

Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)

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1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.


This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.


SDO ASTM: ASTM International
Document Number D1867
Publication Date Nov. 1, 2013
Language en - English
Page Count 5
Revision Level 13
Supercedes
Committee D09.07
Publish Date Document Id Type View
Nov. 1, 2013 D1867-13 Revision
May 1, 2007 D1867-07 Revision
Sept. 10, 2001 D1867-96 Revision
Sept. 10, 2001 D1867-01 Revision