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ASTM B32-04

Historical Revision

Standard Specification for Solder Metal

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1.1 This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC - Association Connecting Electronic Industries.

1.1.1 These solders include those alloys having a liquidus temperature not exceeding 800°F (430°C).

1.1.2 This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.


SDO ASTM: ASTM International
Document Number B32
Publication Date Nov. 1, 2004
Language en - English
Page Count 9
Revision Level 04
Supercedes
Committee B02.02
Publish Date Document Id Type View
Oct. 1, 2020 B0032-20 Revision
May 1, 2008 B0032-08 Revision
Nov. 1, 2004 B0032-04 Revision
Aug. 10, 2003 B0032-03 Revision
Oct. 10, 2000 B0032-00E01 Revision
Oct. 10, 2000 B0032-00 Revision
Oct. 1, 2014 B0032-08R14 Reaffirmation